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A team of researchers led by Osaka University developed an inexpensive large-scale flexible thermoelectric generator (FlexTEG) module with high mechanical reliability for highly efficient power generation. Through a change in direction of the top electrodes at the two sides of the module and the use of high density packaging of semiconductor chips, the FlexTEG module has more flexibility in any uniaxial direction. This improved efficiency of recovery, or thermoelectric conversion, of waste heat from a curved heat source, enhancing the module's mechanical reliability as less mechanical stress is placed on semiconductor chips in the module.

The team's research results were published in Advanced Materials Technologies.

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