Next-Generation Computers: Advance in Microchannel Manufacturing Opens New Industry Applications

Engineers at Oregon State University have invented a new way to use surface-mount adhesives in the production of low-temperature, microchannel heat exchangers -- an advance that will make this promising technology much less expensive for many commercial applications.

This type of technology will be needed, researchers say, in next-generation computers, lasers, consumer electronics, automobile cooling systems, fuel processors, miniature heat pumps and more.