A new form of electronics manufacturing which embeds silicon nanowires into flexible surfaces could lead to radical new forms of bendable electronics, scientists say.

In a new paper published today in the journal Microsystems and Nanoengineering, engineers from the University of Glasgow describe how they have for the first time been able to affordably 'print' high-mobility semiconductor nanowires onto flexible surfaces to develop high-performance ultra-thin electronic layers.

Those surfaces, which can be bent, flexed and twisted, could lay the foundations for a wide range of applications including video screens, improved health monitoring devices, implantable devices and synthetic skin for prosthetics.

The paper is the latest development from the University of Glasgow's Bendable Electronics and Sensing Technologies (BEST) research group, led by Professor Ravinder Dahiya.

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