An international team of researchers has reported a breakthrough in fabricating atom-thin processors -- a discovery that could have far-reaching impacts on nanoscale chip production and in labs across the globe where scientists are exploring 2D materials for ever-smaller and -faster semiconductors.
The team, headed by New York University Tandon School of Engineering Professor of Chemical and Biomolecular Engineering Elisa Riedo, outlined the research results in the latest issue of Nature Electronics.
They demonstrated that lithography using a probe heated above 100 degrees Celsius outperformed standard methods for fabricating metal electrodes on 2D semiconductors such as molybdenum disulfide (MoS2). Such transitional metals are among the materials that scientists believe may supplant silicon for atomically small chips. The team's new fabrication method -- called thermal scanning probe lithography (t-SPL) -- offers a number of advantages over today's electron beam lithography (EBL).
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