NIMS has developed a dual surface architectonic process which enables to print submicrometer-scale circuit patterns by increasing the chemical polarity of predetermined areas on surface, thereby promoting selective adhesion of metallic nanoparticles to these areas. In this process, the patterned polarity is achieved by simple treatments in ambient air which increase the surface's adhesiveness to ink in the treated areas. As a result, very fine circuit lines (0.6 µm in width) can be printed.
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