Intel unveiled new advances in research to keep Moore’s Law on track to one trillion transistors on a single package within the next decade. At the IEEE International Electron Devices Meeting (IEDM) 2022, Intel researchers showcased advances in 3D packaging technology, 10-fold increase in density, new materials for scaling 2D transistors beyond the RibbonFET level, including a ultrathin just 3 atoms thick, new advances in energy efficiency and memory for faster computing, and advances in quantum computing.
To read more, click here.