As devices get smaller and more powerful, the risk of them overheating and burning out increases substantially. Despite advancements in cooling solutions, the interface between an electronic chip and its cooling system has remained a barrier for thermal transport due to the materials' intrinsic roughness.
Sheng Shen, Professor in the Department of Mechanical Engineering at Carnegie Mellon University has fabricated a flexible, powerful, and highly reliable material to efficiently fill the gap.
"At first glance, our solution looks like any ordinary copper film, but under a microscope the novelty of our material becomes clear," explained Lin Jing, PhD student.
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