A new thermoelectric device developed by scientists at Penn State University shows great promise in providing cooling solutions for next-generation electronics. With smaller and more powerful components, these electronics require improved cooling capabilities.
The new thermoelectric cooler offers enhanced cooling power density and efficiency compared to current commercial units, making it a potential solution for managing heat in high-power electronics.
A research team led by Bed Poudel, a research professor in the Department of Materials Science and Engineering at Penn State, has demonstrated that the new material used in the thermoelectric device can outperform existing cooling modules while remaining competitive in terms of cost-effectiveness.
This development holds significant potential for the future generation of electronics. Thermoelectric coolers operate by utilizing the application of electricity to transfer heat from one side of the device to the other, resulting in a temperature disparity.
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