Penn State researchers have created a thermoelectric cooler that significantly improves cooling power and efficiency for future high-power electronics. The device uses half-Heusler alloys and a unique annealing process to yield higher cooling power density and carrier mobility.
Revolutionary Thermoelectric Cooler for Next-Generation Electronics
The development of next-generation electronics, set to feature smaller yet more powerful components, calls for innovative cooling solutions. A newly designed thermoelectric cooler, the brainchild of Penn State scientists, notably improves cooling power and efficiency compared to existing commercial thermoelectric units. This development, the researchers believe, could be instrumental in managing heat in upcoming high-power electronics.
Bed Poudel, research professor in the Department of Materials Science and Engineering at Penn State, expressed optimism about the device’s future applications. He said, “Our new material can provide thermoelectric devices with very high cooling power density. We were able to demonstrate that this new device can not only be competitive in terms of technoeconomic measures but outperform the current leading thermoelectric cooling modules. The new generation of electronics will benefit from this development.”
To read more, click here.