Two-dimensional transition-metal dichalcogenides (2D TMDs), especially MoS2, are at the forefront of new-generation 2D materials, and industrial-level efforts are being made to produce them at a large scale with reasonable performance for electronic device applications. Usually, for display applications, charge carrier mobility of 2 cm2/V.s is sufficient.
Though mechanically exfoliated MoS2 is well-known to have much higher mobility than this, its large-area production is challenging. Further, it is unclear how the performance of 2D TMD devices will be if they are contacted by new generation 2D metals instead of standard 3D metals such as Au, Ti, Ni, etc.
Hence, researchers at Eindhoven University of Technology (Tue), The Netherlands and SRM Institute of Science and Technology (SRMIST), India, have reported recently in Nanoscale Advances on the large-area growth of 2D metal TiSx on top of 2D semiconductor MoS2 by plasma-enhanced atomic layer growth (PEALD) technique.
It's very challenging to optimize the growth conditions to obtain an atomically clean interface between such materials. Researchers found that the transistor performance of MoS2 is almost two times better when contacted with the 2D metal TiSx compared to Ti and Au 3D metals. The trend was observed in most of the figures-of-merit of the transistor. This procedure can be utilized for many such materials in the future.\
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