Researchers at the Tokyo Institute of Technology, in collaboration with the National Institute of Information and Communications Technology (NICT) in Japan, have built a novel wireless chipset with a data transmission rate of 640 Gbps.
The chip can be fabricated using the Complementary Metal-Oxide-Semiconductor (CMOS) process, making it cost-effective and suitable for large-scale production.
We currently use millimeter-wave frequency bands to meet the increasing demand for faster wireless internet services that can also process large amounts of data.
The fifth generation of mobile internet services, popularly known as 5G, operates at a frequency of 24-47 GHz and can offer data transfer speeds as high as 10 Gbps.
The next generation of this communication network will use bands in the frequency range of 110-170 GHz, and wireless chipsets that can operate in this range need to be developed. However, at these frequencies, there is an increased likelihood of attenuation – loss in the amplitude of the signal.
So, the chipset must be designed to ensure that the generated signal can maintain its strength.
The researchers, led by Kenichi Okada, a professor at the School of Engineering at the Tokyo Institute of Technology, used the 65 nm silicon architecture to make a chipset with a bandwidth of 56 GHz.
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