In the race to make electronics smaller, faster, and more efficient, scientists at King Abdullah University of Science and Technology (KAUST) in Saudi Arabia have achieved a breakthrough that could reshape the future of microchips.
They have built the world’s first six-stack hybrid CMOS (complementary metal-oxide semiconductor) microchip tailored for large-area electronics. Until now, hybrid chips with vertical stacking were limited to two layers.
“In microchip design, it is all about packing more power in less space. By refining multiple steps in the fabrication, we provide a blueprint for scaling vertically and increasing functional density far beyond today’s limits,” Saravanan Yuvaraja, lead researcher and a postdoc at KAUST, said.
According to the researchers, this is more than just a technical feat, as it points toward a new architecture for smart electronic devices, wearables, and medical devices.
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