For decades, smaller and more powerful electronic components have fueled major advances in technology. Now scientists are searching for the next breakthrough in computer chip design, and many researchers believe 2D materials could play a key role. These ultrathin materials, made from just one or a few atomic layers, have been viewed as promising candidates for building even tinier electronic devices.
But new research from TU Wien suggests that many of these materials may not work as expected in real-world chip technology. The problem is not just the material itself. Scientists found that when 2D materials are paired with insulating layers required for electronic devices, an unavoidable atomic-scale gap forms between them. That tiny separation can significantly reduce performance and create a fundamental barrier to further miniaturization.
The findings could help the semiconductor industry avoid spending billions of dollars on approaches that may never overcome these physical limitations.
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