Researchers at North Carolina State University have engineered a thin film that combines exceptional stiffness with extreme thermal insulation. Its thermal conductivity ranks among the lowest reported for a dense, nonporous material, approaching the theoretical limit for how effectively such a material can block heat. The film can also be printed at large scales and applied as a coating.
“Stiff materials that are good thermal insulators would have substantial utility in a variety of applications, from cookware to electronic devices to space travel,” says Dali Sun, a physics professor at NC State and co-corresponding author of a journal article describing the work.
Creating a material with both properties is difficult because stiffness and heat transfer generally go together. Materials that resist deformation typically conduct heat well, while effective insulators tend to be less stiff.
“But this is a significant challenge,” Sun says. “Because, in general, stiff materials are good at conducting heat, and materials that are not stiff are good at insulating against heat. We’ve created a material that is very stiff and is extremely good at insulating against heat. Better than any material you would find in nature.”
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