Ever smaller and ever more compact—this is the direction in which computer chips are developing, driven by industry. This is why so-called 2-D materials are considered to be the great hope: they are as thin as a material can possibly be, in extreme cases they consist of only one single layer of atoms. This makes it possible to produce novel electronic components with tiny dimensions, high speed and optimal efficiency.

However, there is one problem: always consist of more than one material. 2-D materials can only be used effectively if they can be combined with suitable material systems—such as special insulating crystals. If this is not considered, the advantage that 2-D materials are supposed to offer is nullified. A team from the Faculty of Electrical Engineering at the TU Wien (Vienna) is now presenting these findings in the journal Nature Communications.

To read more, click here