Researchers at Columbia Engineering have for the first time used DNA to help create 3D electronically operational devices with nanometer-size features.
"Going from 2D to 3D can dramatically increase the density and computing power of electronics," said corresponding author Oleg Gang, professor of chemical engineering and of applied physics and materials science at Columbia Engineering and leader of the Center for Functional Nanomaterials' Soft and Bio Nanomaterials Group at Brookhaven National Laboratory.
The new manufacturing technique could also contribute to the ongoing effort to develop AI systems that are directly inspired by natural intelligence.
"3D electronic architectures that imitate the natural 3D structure of the brain may prove enormously more effective at running brain-mimicking artificial intelligence systems than existing 2D architectures," Gang said. The researchers detailed their findings March 28 in the journal Science Advances.
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